Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods

ABSTRACT

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

A claim for the benefit of priority to U.S. Provisional PatentApplication No. 61/584,939, filed on Jan. 10, 2012 and titled METHODSFOR MASKING ELECTRONIC DEVICES FOR APPLICATION OF PROTECTIVE RESISTANTCOATINGS THERETO, MASKS FOR USE IN APPLYING PROTECTIVE COATINGS TOELECTRONIC DEVICES AND MASKED ELECTRONIC DEVICES (“the '939 ProvisionalApplication”), is hereby made under 35 U.S.C. §119(e). The entiredisclosure of the '939 Provisional Application is, by this reference,incorporated herein.

TECHNICAL FIELD

This disclosure relates generally to methods for applying protective(e.g., moisture-resistant, etc.) coatings to electronic assemblies. Sucha method may include masking the electronic assembly prior toapplication of a protective coating to the electronic assembly. Thepresent disclosure also relates to masks that may be used to shieldportions of an electronic assembly during coating processes, as well asto masked electronic devices.

SUMMARY

One or more masks may be used to control the application of material ofa protective coating, or “protective material,” and, thus, theapplication of a protective coating to one or more portions of variouscomponents of an electronic device during assembly of the electronicdevice. A mask may be planar or substantially planar, or it may benonplanar. The planarity (or nonplanarity) of a mask may result from theplanarity (or nonplanarity) of the electronic assembly over which themask is formed (e.g., when conformal coating processes are used, whenthe mask contacts or substantially contacts all of the portions of thesurface of the electronic assembly that it covers, etc.).

As used herein, the term “protective coating” includesmoisture-resistant coatings, as well as other coatings that protectvarious parts of an electronic assembly from external influences. Theterm “moisture resistant” refers to the ability of a coating to preventexposure of a coated element or feature to moisture. Amoisture-resistant coating may resist wetting or penetration by one ormore types of moisture, or it may be impermeable or substantiallyimpermeable to one or more types of moisture. A moisture-resistantcoating may repel one or more types of moisture. In some embodiments, amoisture-resistant coating may be impermeable to, substantiallyimpermeable to or repel water, an aqueous solution (e.g., saltsolutions, acidic solutions, basic solutions, drinks, etc.) or vapors ofwater or other aqueous materials (e.g., humidity, fogs, mists, etc.),wetness, etc.). Use of the term “moisture-resistant” to modify the term“coating” should not be considered to limit the scope of materials fromwhich the coating protects one or more components of an electronicdevice. The term “moisture resistant” may also refer to the ability of acoating to restrict permeation of or repel organic liquids or vapors(e.g., organic solvents, other organic materials in liquid or vaporform, etc.), as well as a variety of other substances or conditions thatmight pose a threat to an electronic device or its components. Variousaspects relating to the use of masks in the application of protectivecoatings are disclosed.

In one aspect, a method for applying a protective coating to anelectronic device includes assembling two or more components of theelectronic device with one another. A mask may then be applied to theresulting electronic assembly. The mask may shield selected portions ofthe electronic assembly, while other portions of the electronicassembly, i.e., those to which a protective coating is to be applied,may remain exposed through the mask. With the mask in place, applicationof a protective coating to portions of the electronic assembly exposedthrough the mask may commence. After application of the protectivecoating, the mask may be removed from the electronic assembly. In someembodiments, one or more additional components may then be added to anelectronic assembly to which a protective coating has been applied.Another mask may be applied to this larger electronic assembly, andanother protective coating may then be applied to areas of the largerelectronic assembly that are exposed through the mask.

In some embodiments, the mask may be formed on the electronic assembly.The mask may be selectively formed on, defined on or applied to areas ofthe electronic assembly that are exposed, but not to be covered with aprotective coating. Without limitation, such areas may includecomponents from which a protective coating may interfere with thermaltransmission or features whose functionality may be detrimentallyaffected by protective coating. Non-limiting examples of the latterinclude various transducers (e.g., audio elements, such as microphones,speakers, etc.; camera lenses; etc.), features with moving parts (e.g.,silent mode vibrating elements, autofocus elements of camera lenses,etc.), communication components (e.g., communication ports, power ports,audio jacks, etc.), memory card receptacles (e.g., for secure digital(SD) cards, subscriber identity module (SIM) cards, universal serial bus(USB) or micro USB ports, etc.) and the like.

A variety of techniques may be used to form a mask on an electronicassembly, define a mask on an electronic assembly, or otherwiseselectively apply a mask to an electronic assembly. As one example, amask material may be selectively applied to areas of the electronicassembly that are to remain free from coverage by a protective coating.As another example, a mask material may be applied over an entire areaof an electronic assembly then selectively removed from locations towhich a protective coating is to be applied.

After a protective coating has been applied to portions of an electronicassembly exposed through a mask that was defined on the electronicassembly, the mask may be selectively removed from the electronicassembly. A mask that has been defined in place may be mechanicallyremoved from the electronic assembly. Some non-limiting examples ofmechanical removal include peeling and abrasion (e.g., with frozen gas(e.g., carbon dioxide (CO₂), nitrogen (N₂), etc.), corn starch, sand,glass, etc.). Alternatively, a mask that has been defined in place maybe chemically removed from the electronic assembly. In embodiments wherechemical removal techniques are employed, the defined-in-place mask maybe removed with selectivity over the material of the protective coating(i.e., the protective coating may remain intact over desired locationsof the electronic assembly). Although selective chemical removalprocesses may not have a significant chemical affect on portions of theprotective coating that were formed over the mask, those portions of theprotective coating may be “lifted off” of the electronic assembly as themask is chemically removed from the assembly.

In other embodiments, the mask may comprise a preformed apparatus, whichmay include one or more elements configured to be assembled with theelectronic assembly and, optionally, with one or more other elements ofthe preformed mask. When a preformed mask is used in the application ofa protective coating to an electronic assembly, a seal or a sealingagent (e.g., an elastomer, etc.) may be applied to a surface of theelectronic assembly, and may reside between the electronic assembly andthe mask once the mask is in place on the electronic assembly. In someembodiments, the seal may comprise a part of the preformed mask that isconfigured for assembly against the electronic assembly. A preformedmask may even be formed from a solid elastomeric material that willfunction as a seal. In other embodiments, a seal or sealing agent may beconfigured for application to one or both of the preformed mask and theelectronic assembly before the preformed mask is assembled with theelectronic assembly. When sufficient force is applied to one or both ofthe preformed mask and the electronic assembly in the appropriatedirection(s), the seal or sealing agent may define a discrete boundarybetween each masked region and its adjacent region(s) that is (are) tobe covered with a protective coating to prevent the introduction ofprotective material at locations between the electronic assembly and thepreformed mask and, thus, may enable the formation of a protectivecoating with a discrete periphery.

In embodiments where a sealing agent is applied to the electronicassembly or mask, the sealing agent may comprise a material that isconfigured for selective application. The sealing agent may comprise anelastomer that may be viscous when first applied and subsequentlysolidify to form a seal and, thus, delineation between coated anduncoated regions. Non-limiting examples of sealing agents that areinitially viscous then solidify include liquid latex and hot meltadhesive, which is typically referred to as “hot glue.” Alternatively,the sealing agent may remain relatively viscous. Examples of sealingagents that remain relatively viscous include gels, greases and othermaterials that will maintain their viscosity when subjected to elevatedtemperatures and/or pressures of the material deposition process.

A preformed mask may comprise one or more features that interact withcorresponding features of the electronic assembly to which they areconfigured to be assembled. In a specific embodiment, a protrudingfeature may be positioned on an interior surface of the preformed maskto depress a button of the electronic assembly when the preformed maskis positioned on the electronic assembly. In another specificembodiment, a a preformed mask may include one or more features thatprevent the introduction of protective material into ports (e.g.,communication ports, power ports, audio jacks, etc.) or receptacles(e.g., SIM card receptacles, memory card slots, etc.) of the electronicassembly. These features may be configured to cover ports or receptaclesto keep the protective material out of these features, or these featuresmay be configured to be received by the ports or receptacles.

Once the protective coating has been formed, a preformed mask may beremoved from an electronic assembly merely by disassembling the maskfrom the electronic assembly. Thereafter, the preformed mask may becleaned. For example, protective material may coat portions of thepreformed mask. A residue of a sealing agent may also remain on surfacesof the preformed mask following its removal from the electronicassembly. Once the mask has been cleaned, it may be reused; i.e., placedon another electronic assembly to mask portions of that electronicassembly as a protective coating is applied to other portions of theelectronic assembly.

An electronic assembly may be masked with a combination of preformedelements and elements that are defined on the electronic assembly. Insome embodiments, both preformed and defined-in-place mask elements mayreside on an electronic assembly concurrently and, thus, be usedsimultaneously. In other embodiments, one or more mask elements that aredefined in place may be used at a different point in the process ofassembling an electronic device than masks that include one or morepreformed elements.

Embodiments of masked electronic assemblies are also disclosed. A maskedelectronic assembly includes an electronic assembly and a mask. The maskmay include one or more features that are defined in place on theelectronic assembly, one or more preformed elements, or a combination ofdefined-in-place and preformed elements.

Other aspects, as well as features and advantages of various aspects, ofthe disclosed subject matter will become apparent to those of ordinaryskill in the art though consideration of the ensuing description, theaccompanying drawings and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1 illustrates an embodiment of a process in which a protectivecoating is applied to a portion of an electronic assembly, which processincludes the assembly of at least two components of an electronicdevice, application of a mask to the electronic assembly formed by thosecomponents, application of the protective coating to the electronicassembly, and removal of the mask from the electronic assembly;

FIGS. 2 through 4 are schematic representations of embodiments ofelectronic assemblies with masks and/or protective coatings on some, butnot all, areas of their surfaces;

FIG. 5 depicts an embodiment of a preformed mask configured to be placedon and disassembled from surfaces of an electronic assembly that areconfigured to be located within an interior of an electronic device;

FIG. 6 shows an embodiment of a preformed mask with at least one featurethat interacts with a corresponding feature of an electronic assembly oran electronic device when the preformed mask is placed on the electronicassembly or electronic device; and

FIG. 7 illustrates an embodiment of a system for applying protectivecoatings to electronic assemblies, showing a masking element, aprotective coating element and a de-masking element.

DETAILED DESCRIPTION

The disclosed subject matter, in various embodiments, includes methodsfor shielding selected surfaces or features of electronic assembliesduring application of protective coatings (e.g., moisture resistantcoatings, etc.) to the electronic assemblies and/or components of theelectronic assemblies. A mask may shield one or more features of theelectronic assembly and/or its components for a variety of reasons,including, without limitation, to enable electrical connectivity betweencomponents following application of the protective coating to theelectronic assembly, to provide access to interactive features of anelectronic device of which the electronic assembly is a part, foraesthetic purposes (e.g., to limit or prevent application of theprotective coating to one or more exterior features of an electronicdevice, such as a display, etc.), to prevent interference with variouscomponents (e.g., features with moving parts, transducers, communicationcomponents, card receptacles, etc.), and to enable the transmission oflight or other electromagnetic radiation to or from one or morecomponents of the electronic assembly or a device of which theelectronic assembly is a part.

With reference to FIG. 1, a series of elements of a process 10 forapplying a protective coating to an electronic assembly is described, asare embodiments of the manner in which masking, coating and relatedprocesses may fit into the process of assembling a finished electronicdevice. Various embodiments of electronic assemblies 100, 100′, 100″ areshown in FIGS. 2 through 4.

At reference 20 of FIG. 1, and with added reference to FIG. 2, two ormore components 102, 104 of an electronic device (e.g., a circuit board(e.g., printed wiring board, ceramic board, etc.); another carrier, suchas a silicon interposer; etc.) and another electronic component, such asa packaged semiconductor device, an antenna, a display, anotherelectronic subassembly including its own circuit board, etc.; twocomponents of an electronic device; etc.) are assembled with oneanother. The resulting electronic assembly 100 (which may comprise afinished electronic device or a device under assembly, or a subassembly)may include features that are to be located within a finished electronicdevice, features that are to be located on the outside of the finishedelectronic device or a combination of internal and external features.

In some embodiments, all or part of the electronic assembly 100 may beprepared before applying a mask 110 to selected areas of the electronicassembly 100. Such preparation may include, but is not limited to,processes that will enable the mask to limit the application of one ormore protective materials to masked areas of the electronic assembly. Asanother option, preparation of an electronic assembly may preventadhesion of a mask to certain areas that are to be exposed laterallybeyond or through the mask. In yet another option, an electronicassembly may be processed to facilitate adhesion of a protectivematerial to certain areas of the electronic assembly to which aprotective coating is to be applied. Non-limiting examples of suchprocesses include cleaning processes, processes for applying certainmaterials (e.g., sealants, release agents, etc.), processes forimparting one or more areas of a surface with a desired texture, and thelike. In a specific embodiment, FIG. 2 shows the application of asealing agent (e.g., by jetted printing, screen printing, spraying,etc.) or a seal 112 (e.g., by assembly processes, etc.) to selectedportions of the electronic assembly 100. Alternatively, a seal 112 orsealing agent may be applied to selected portions of a preformedembodiment of a mask 110, or to selected portions of both the electronicassembly 100 and a preformed embodiment of a mask 110.

It may be desirable to prevent the application of a protective coatingto one or more surfaces 106 of the electronic assembly 100; applicationof the protective coating may be limited to unmasked portions 108 of theelectronic assembly 100 (i.e., portions that are exposed through themask 110). Accordingly, at reference 22 of FIG. 1, a mask 110 is appliedto the electronic assembly. The mask 110 may be applied to an electronicassembly 100 in a way that prevents the protective material fromcontacting areas of the electronic assembly 100 that are covered by themask 110.

Manual or automated processes may be used to apply the mask 110 to theelectronic assembly 100. A mask 110 may be formed or otherwise definedon the electronic assembly 100, for example, by applying a mask materialto the electronic assembly 100. In some embodiments, the mask materialmay comprise an unconsolidated material, such as a liquid or uncuredmaterial. As an unconsolidated mask material is applied to theelectronic assembly 100, it may at least partially conform to thecontour of the electronic assembly 100. In some embodiments, includingthose where the speed with which a mask may be removed is more desirablethan the extent to which high aspect ratio features are masked, the mask110 may only partially conform to the contour of the area of theelectronic assembly 100 to which it applied. In other embodiments, anunconsolidated mask material may be applied in a manner that minimizesthe likelihood that any gaps will form between the mask 110 and theelectronic assembly 100, including situations where reliable masking ofhigh aspect ratio features is desired. In such embodiments, the mask 110may conform substantially or completely to the contour of the area ofthe electronic assembly 100 to which it is applied. The viscosity,temperature and/or other properties of a masking material may affect itsability to conform and, thus, the extent to which it conforms to asurface to which it is applied. Once the mask material has been appliedto selected locations of an electronic assembly 100, the mask materialmay then harden or cure. In some embodiments, the application of a mask110 to an electronic assembly 100 may include additional processing. Asa non-limiting example, the mask material may be applied underconditions (e.g., under a vacuum, etc.), at a temperature, etc. thatminimizes or prevents the occurrence of gaps between the mask 110 andthe electronic assembly.

In some embodiments, a mask material may comprise one or more films thatare configured to be placed on and secured to the electronic assembly100. In some embodiments, such a masking film may be subjected toconditions that hold it in place in the electronic assembly 100 and/orsecure it to the electronic assembly 100. In addition, a masking filmmay be subjected to conditions that enable it to conform orsubstantially conform to the shape(s) of the surface(s) to which themasking film is applied. Without limitation, such conditions may includethe selective application of pressure to the masking film in a mannerthat forces it against the surface(s) that are to be covered by a mask110. As an example, a positive pressure may be applied to force themasking film against a desired location of the electronic assembly 100.As another example, a negative pressure, such as a vacuum, may beapplied to a masking film to draw the masking film against theelectronic assembly 100. Optionally, positive pressure and negativepressure may be employed in conjunction with one another; for example,positive pressure may be momentarily applied (e.g., as a burst of gas orair, etc.) to press the masking film against the electronic assembly100, then a negative pressure may draw the masking film against theelectronic assembly 100; holding it in place on the electronic assembly100. Heat may be applied to a masking film to increase its pliabilityand, thus, its ability to conform. Heat may also cause the masking film,or an adhesive on the masking film, to adhere to the surface of theelectronic assembly. In embodiments where each film from which a mask110 is to be formed comprises a material that will shrink when heated,the masking film and, optionally, the electronic assembly 100 may beheated to enable the material to engage and/or adhere to features of theelectronic assembly 100 that it covers. A masking film may have athickness

Nonlimiting examples of masking films that will shrink when heatedinclude polyethylene films (e.g., that marketed by 3M Company ofMaplewood, Minn., as Polyethylene Protective Tape 2E97C, etc.) andpolyvinyl chloride (PVC) films. An adhesive material (e.g., apressure-sensitive adhesive, a silicone coating, etc.) may be providedon a surface of the masking film to enable it to be temporarily securedto a substrate before it is heated. The thickness of a masking film maydepend upon the desired thickness of the mask and, thus, may compriseany of a wide range of thicknesses. By way of non-limiting example, inspecific embodiments, a masking film may have a thickness of about 2mils (i.e., about 0.05 mm) to about 4 mils (i.e., about 0.1 mm).

Masks 110 that are formed on electronic assemblies 100 may be configuredfor compatibility with the process(es) that will be used to form aprotective coating on one or more parts of the electronic assembly 100.As an example, relatively thin masks 110 may be used when a protectivecoating will be formed by directional or anisotropic depositionprocesses to avoid the occurrence of unprotected areas adjacent to theouter periphery of the mask 110, which might otherwise occur due toshadowing if the mask 110 were thicker. As another example, whenanisotropic deposition processes will be used to form a protectivecoating, masks 110 with openings that have one or more dimensions thatexceed the mean free path of particles or molecules of protectivematerial may be used to ensure that the thickness throughout theprotective coating is uniform. Conversely, a protective coating may beformed with areas that have different thicknesses than one another byforming a mask 110 with at least one opening that has one or moredimensions that exceed the mean free path of the particles or moleculesthat will form the protective coating and at least one opening that hasone or more dimensions that are smaller than the mean free path of theparticles or molecules of protective material that will form theprotective coating. In yet another example, masks 110 that maintain goodadhesion with, and remain in close contact with, electronic assemblies100 when subjected to the conditions under which protective layers areformed are useful with a variety of different processes, includingisotropic (i.e., multi-directional or from all directions) depositionprocesses, where protective material might otherwise creep under theedges of a mask 110.

Alternatively, a preformed mask 110 may be placed on, or assembled with,the electronic assembly 100. Assembly of the preformed mask 110 with theelectronic assembly 100 may be effected in such a way that the preformedmask 110 exerts force against the electronic assembly 100, which mayhold the preformed mask 110 in place and prevent exposure of areascovered by the preformed mask 110 to protective material. Such force maybe achieved by application of pressure or force. For example, a negativepressure, such as a vacuum, may be applied to the mask 110 to pull itagainst the electronic assembly 100. As another example, a positivepressure or force may be applied to the mask 110 to hold it against theelectronic assembly 100.

A mask 110 that incorporates teachings of this disclosure may have athree-dimensional structure. In some embodiments, a mask 110 may extendover portions of surfaces of an electronic assembly 100 that face inopposite or substantially opposite directions. As an example, a mask 110may cover at least portions of opposite surfaces of an electronicassembly 100 or of a component of an electronic assembly 100. In anotherexample, a mask 110 may cover opposing, or facing, spaced-apart surfacesof two or more components.

Turning now to FIG. 3, and at reference 24 of FIG. 1, with the mask 110in place, a protective coating 120 may be selectively applied tounmasked portions 108 of the electronic assembly 100′. A variety ofprocesses may be used to apply a protective coating 120 to unmaskedportions 108 of the electronic assembly 100′, including, withoutlimitation, those disclosed by U.S. patent application Ser. No.13/736,753, filed on Jan. 8, 2013 and titled SYSTEMS FOR ASSEMBLINGELECTRONIC DEVICES WITH INTERNAL MOISTURE RESISTANT COATINGS (“the '753application”) and those disclosed by U.S. patent application Ser. No.13/735,862, filed on Jan. 7, 2013 and titled ELECTRONIC DEVICES WITHINTERNAL MOISTURE RESISTANT COATINGS (“the '862 application”). Theentire disclosures of both the '753 application and the '862 applicationare, by this reference, incorporated herein.

Thereafter, at reference 26 of FIG. 1, the mask 110 may be removed fromthe electronic assembly 100′, leaving the protective coating 120 onselected portions (i.e., the previously exposed portions 108) of theelectronic assembly 100′. An illustrative embodiment of the resultingelectronic assembly 100″ is shown in FIG. 4.

The masking and coating processes could occur during assembly of anelectronic device and/or once assembly of the electronic device iscomplete. A mask may be applied manually, by automated equipment, or bya combination of both manual and automated processes. When masking andcoating occur during assembly of an electronic device, the mask may beapplied to an electronic assembly 100 (FIG. 2) immediately before aprotective coating is formed on the electronic assembly 100, or the maskmay be applied to the electronic assembly 100 at one or more pointsduring the assembly process that are most convenient or at whichapplication of the mask 100 are most easily achieved. In someembodiments, more than one protective coating may be applied to anelectronic assembly and/or its components, in various stages ofassembly. Accordingly, an assembly process may include a plurality ofmasking processes, a plurality of coating processes and a plurality ofmask removal, or “de-masking,” processes.

In embodiments where a protective coating is applied to a finishedelectronic device 100′″ (which may take the place of the electronicdevice 100 in the process depicted by FIG. 1), some disassembly of theelectronic device 100′″ may provide access to the components thatrequire masking.

Masking and coating may be followed by removal of the mask. When themask has been formed on an electronic assembly 100 (FIG. 2) or on anelectronic device 100′″, it may be removed mechanically (e.g., bypeeling, abrasion, etc.), chemically (e.g., by etching or dissolvingmaterial of the mask with selectivity over removal of the protectivecoating, etc.), by radiation (e.g., with laser beams, electron beams,X-rays, high intensity light, etc.), or by any other suitable means formask removal. In embodiments where the mask comprises one or morepreformed elements (see, e.g., FIGS. 5 and 6), removal of the mask maycomprise disassembly of the mask from the electronic assembly 100 (FIG.2).

Individual components of an electronic assembly or the interior of anelectronic device may be shielded from application of a material thatforms a protective coating. These components may include electricalcontacts, light transmission elements (e.g., cameras, projectors, etc.),sensors, and other components. These components may be masked with areusable or disposable system that is specifically configured for thecomponent geometry and location. This system may include a predeterminednumber of contact covers that can be applied to the electronic devices.The covers could be affixed by an adhesive, an elastic/pressureconnection, a static connection, and/or geometrical constraints. Thissystem could be made from multiple material types for both structuralsupport and to ensure uniform contact to the shielded component. Thepoints of contact to the electronic assembly or electronic device mayuniformly and effectively seal the shielded feature or component fromthe protective coating deposition. These contact points may comprise asoft material (e.g., a polymer, such as silicone or latex, etc.), agrease, a gel, a curable liquid, or the like.

A preformed mask 110′, such as that depicted by FIG. 6, may beconfigured to shield the exterior of a finished electronic device 100′″from a protective coating material. A preformed mask 110′ may have anyof a variety of configurations. Without limitation, a preformed mask110′ may include a snap-in fixture; a multi-part fixture that snaps oradheres together; a shrink-wrap coating that is activated by heat, UVradiation, or some other curing mechanism; a silicone or other polymertype cover; a cover that uses static or Van der Waals interactions toadhere; a gel or liquid that is applied to the exterior and cured; andmasks that are printed directly on to the device exterior. A preformedmask may be disposable (i.e., configured to be used once) or it may bereusable. Following use, a reusable embodiment of a preformed mask maybe cleaned other otherwise prepared before it is again applied to anelectronic assembly or an electronic device.

In embodiments where the electronic device 100′″ includes one or moreinterface elements 108 (e.g., buttons, dials, switches, etc.), it may bedesirable to shield one or more of the interface elements 108 from theprotective coating. In some embodiments, it may be desirable to ensurethat an interface element 108 (e.g., a button, switch, etc.) will makethe necessary electrical contacts when placed in an “on” or connectedposition. In such embodiments, the preformed mask 110′ may include oneor more features 118′ (e.g., protrusions, etc.) for engaging acorresponding interface element 108 in the desired position (e.g., bydepressing a button, by holding a switch in the appropriate position,etc.). Alternatively, one or more inserts may be assembled with theelectronic device 100′″ and/or the preformed mask 110′. In anyembodiment, the material and/or construction of the preformed mask 110′(e.g., its rigidity, stiffness, elasticity, shape, etc.) may enable sucha feature 118′ to accomplish its intended task.

In an alternative embodiment, an external feature (e.g., a tension band,etc.) may be assembled or otherwise used in conjunction with a mask(preformed or formed on the electronic assembly or electronic device) toapply any force needed to engage and maintain an interface element 118′in a desired position while a protective coating is applied to all orpart of an electronic assembly 100 (FIG. 2) or electronic device 100′″.

In embodiments where the mask is formed on an electronic assembly or anelectronic device, all or part of the electronic assembly or electronicdevice may be masked by applying a masking material that may cure orotherwise harden to define a mask. As a non-limiting example, themasking material may comprise a liquid material or a gel material thatmay harden or cure over time or that may be cured by exposure to heat, acatalyst, electromagnetic (e.g., ultraviolet (UV), etc.) radiation, oranother curing agent or condition.

In some embodiments, a selectively curable material (e.g., a radiationcurable material, etc.) may also, or alternatively, be employed as amoisture-resistant coating on portions of an electronic component, anassembly of electronic components, or an electronic device.

In another aspect, a system for applying a protective coating to anelectronic assembly (see, e.g., the '753 application and the '862application) may include a masking element, or station, that isconfigured to form a mask in accordance with teachings of thisdisclosure. Additionally, such a system may include one or more maskremoval elements, or stations, also employing teachings of thisdisclosure. FIG. 7 illustrates an embodiment of a system 200 forapplying protective coatings to electronic assemblies, showing a maskingelement 210, a protective coating element 220 and a de-masking element230. As a plurality of protective coatings may be applied to anelectronic assembly, or electronic assemblies at various stages ofassembly, during the assembly components to manufacture an electronicdevice, a system 200 may include a corresponding number of maskingelements 210, protective coating elements 220 and de-masking elements230.

Although the foregoing description contains many specifics, these shouldnot be construed as limiting the scope of any of the appended claims,but merely as providing information pertinent to some specificembodiments that may fall within the scopes of the appended claims.Features from different embodiments may be employed in combination. Inaddition, other embodiments of the disclosed subject matter may also bedevised which lie within the scopes of the appended claims. The scopesof the claims are, therefore, indicated and limited only by the plainlanguage used in each claim and the legal equivalents to the elementsrecited by the claims. All additions, deletions and modifications to thedisclosed subject matter that fall within the meaning and scopes of theclaims are to be embraced by the claims.

What is claimed:
 1. A method for coating an electronic device,comprising: assembling a plurality of components of an electronic deviceto form an electronic assembly; applying a mask to the electronicassembly, the mask shielding at least a portion of the assembly;applying a protective coating to at least two components of theelectronic assembly with the mask in place; and removing the mask fromthe electronic assembly, the protective coating remaining on coatedportions of the electronic assembly, uncoated portions of the electronicassembly being exposed through the mask.
 2. The method of claim 1,wherein assembling the plurality of components comprises assembling aplurality of components to be located at least partially within aninterior of the electronic device.
 3. The method of claim 1, furthercomprising: assembling at least one exterior component of the electronicdevice with the electronic assembly, the at least one exterior componentdefining at least a portion of an interior of the electronic device, atleast a portion of the protective coating and at least a portion of theelectronic assembly located within the interior of the electronicdevice.
 4. The method of claim 1, further comprising: applying a sealingagent to the at least a portion of the electronic assembly beforeapplying the mask to the electronic assembly, the sealing agent defininga seal between the mask and the electronic assembly upon applying themask to the electronic assembly.
 5. The method of claim 1, whereinapplying the mask comprises assembling a preformed mask with theelectronic assembly.
 6. The method of claim 5, wherein removing the maskcomprises disassembling the preformed mask from the electronic assembly.7. The method of claim 6, further comprising: cleaning the preformedmask after disassembling the mask from the electronic assembly.
 8. Themethod of claim 6, further comprising: assembling the preformed maskwith another electronic assembly.
 9. The method of claim 6, whereinassembling the preformed mask with the electronic assembly comprisesassembling a mask that depresses at least one button of the electronicdevice with the electronic device.
 10. The method of claim 5, whereinassembling the preformed mask comprises assembling a heat shrink maskwith the electronic assembly, then heating the heat shrink mask.
 11. Themethod of claim 1, wherein applying the mask comprises applying amasking material to the electronic assembly and defining the mask fromthe masking material.
 12. The method of claim 11, wherein applying themask comprises applying a radiation curable masking material to theelectronic assembly and exposing at least a portion of the radiationcurable masking material to radiation that will cure the radiationcurable masking material.
 13. The method of claim 12, wherein applyingcomprises applying the radiation curable material to selected portionsof the electronic assembly.
 14. The method of claim 12, wherein exposingcomprises exposing selected portions of the radiation curable maskingmaterial to the radiation.
 15. The method of claim 11, wherein removingthe mask comprises mechanically removing the mask from the electronicassembly.
 16. The method of claim 15, wherein removing the maskcomprises chemically removing the mask from the electronic assembly, thechemically removing being effected without removing the protectivecoating.
 17. The method of claim 15, wherein removing the mask comprisesradiation processed-removing the mask from the electronic assembly, theradiation processed-removing being effected without removing theprotective coating.
 18. The method of claim 1, wherein applying the maskincludes applying the mask over at least one electrical contact, a lightemission element, an imaging element or a sensor of the electronicassembly and, upon removing the mask, the at least one electricalcontact, the light emission element, the imaging element or the sensoris exposed through the protective coating.
 19. The method of claim 1,further comprising: after removing the mask, assembling at least oneadditional component with the electronic assembly; applying another maskto the electronic assembly to shield at least a portion of the at leastone additional component; applying another protective coating over theanother mask and to at least a portion of the at least one additionalcomponent exposed through the another mask; and removing the anothermask from the electronic assembly, the another protective coatingremaining on a coated portion of the additional component, at least oneuncoated portion of the electronic assembly being exposed through theanother mask.
 20. An electronic assembly, comprising: an electronicassembly including a plurality of assembled components of an electronicdevice; and a mask over a portion of the electronic assembly.
 21. Theelectronic assembly of claim 20, wherein the mask comprises an apparatusremovably assembled with the electronic assembly.
 22. The electronicassembly of claim 21, further comprising: at least one seal between themask and the electronic assembly.
 23. The electronic assembly of claim20, wherein the mask comprises a coating on the electronic assembly. 24.The electronic assembly of claim 20, further comprising: a protectivecoating on the mask and at least one portion of the electronic assemblyexposed through the mask.
 25. A mask configured for assembly with anelectronic assembly, comprising at least one preformed elementconfigured for assembly with and disassembly from an electronicassembly, the at least one preformed element configured to shield atleast a portion of the electronic assembly, at least one aperturedefined through the preformed element to expose another portion of theelectronic assembly, and at least one protruding element configured todepress at least one button of the electronic assembly while the atleast one preformed element is in an assembled relationship with theelectronic assembly.
 26. The mask of claim 25, comprising a plurality ofpreformed elements.
 27. The mask of claim 26, wherein the plurality ofpreformed elements are configured for assembly with one another.